tok3n
06-15-2003, 08:03 AM
I'm planning a major system upgrade soon and have been looking at new i875 Canterwood motherboards. But the ones I have looked at so far, ASUS and ABIT seem to have opted for a new mounting mechanism for the northbridge chipset. Instead of the old holes in the motherboard, they are using metal loops at the 4 corners. The fan or heatink is held on via a bracket or wire to the loops.
http://images.anandtech.com/reviews/motherboards/asus/P4C800/DSC01659.JPG
While this might be a good new system stock, that leave a problem for watercooling the chipset. There is no way to mount the block with the current designs.
Has anyone else noticed this?
Maybe it is unnecessary to watercool these northbrdiges. But my concern - at least for passively cooled chipsets like on the ASUS - is when watercooling the CPU, there will be no more fan from the cpu to blow air onto the chipset heatink from the side.
Are makers of waterblocks going to design new options if this mounting system becomes prevalent?
http://images.anandtech.com/reviews/motherboards/asus/P4C800/DSC01659.JPG
While this might be a good new system stock, that leave a problem for watercooling the chipset. There is no way to mount the block with the current designs.
Has anyone else noticed this?
Maybe it is unnecessary to watercool these northbrdiges. But my concern - at least for passively cooled chipsets like on the ASUS - is when watercooling the CPU, there will be no more fan from the cpu to blow air onto the chipset heatink from the side.
Are makers of waterblocks going to design new options if this mounting system becomes prevalent?